KiCad PCB EDA Suite
DIELECTRIC_PRMS Class Reference

A helper class to manage a dielectric layer set of parameters. More...

#include <class_board_stackup.h>

Public Member Functions

 DIELECTRIC_PRMS ()
 For dielectric (and solder mask) the dielectric loss. More...
 

Private Attributes

wxString m_Material
 
int m_Thickness
 type of material (for dielectric and solder mask) More...
 
bool m_ThicknessLocked
 the physical layer thickness in internal units More...
 
double m_EpsilonR
 true for dielectric layers with a fixed thickness (for impendace controled purposes), unused for other layers More...
 
double m_LossTangent
 For dielectric (and solder mask) the dielectric constant. More...
 

Friends

class BOARD_STACKUP_ITEM
 

Detailed Description

A helper class to manage a dielectric layer set of parameters.

Definition at line 63 of file class_board_stackup.h.

Constructor & Destructor Documentation

◆ DIELECTRIC_PRMS()

DIELECTRIC_PRMS::DIELECTRIC_PRMS ( )
inline

For dielectric (and solder mask) the dielectric loss.

Definition at line 76 of file class_board_stackup.h.

76  :
77  m_Thickness(0), m_ThicknessLocked( false ),
78  m_EpsilonR( 1.0 ), m_LossTangent( 0.0 )
79  {}
int m_Thickness
type of material (for dielectric and solder mask)
double m_EpsilonR
true for dielectric layers with a fixed thickness (for impendace controled purposes),...
bool m_ThicknessLocked
the physical layer thickness in internal units
double m_LossTangent
For dielectric (and solder mask) the dielectric constant.

Friends And Related Function Documentation

◆ BOARD_STACKUP_ITEM

friend class BOARD_STACKUP_ITEM
friend

Definition at line 65 of file class_board_stackup.h.

Member Data Documentation

◆ m_EpsilonR

double DIELECTRIC_PRMS::m_EpsilonR
private

true for dielectric layers with a fixed thickness (for impendace controled purposes), unused for other layers

Definition at line 72 of file class_board_stackup.h.

◆ m_LossTangent

double DIELECTRIC_PRMS::m_LossTangent
private

For dielectric (and solder mask) the dielectric constant.

Definition at line 73 of file class_board_stackup.h.

◆ m_Material

wxString DIELECTRIC_PRMS::m_Material
private

Definition at line 68 of file class_board_stackup.h.

◆ m_Thickness

int DIELECTRIC_PRMS::m_Thickness
private

type of material (for dielectric and solder mask)

Definition at line 69 of file class_board_stackup.h.

◆ m_ThicknessLocked

bool DIELECTRIC_PRMS::m_ThicknessLocked
private

the physical layer thickness in internal units

Definition at line 70 of file class_board_stackup.h.


The documentation for this class was generated from the following file: